For those struggling with semiconductor chip carry-out defects: Improvement case study.
We will introduce a case study of improvements at a power semiconductor manufacturing company.
【Issue】 There have been frequent issues with the return of semiconductor chips in the diamond process, and we were looking for ways to reduce these return defects. 【Improvement Results】 We achieved a reduction in chip return defects, and specifically observed the following improvements: 1) Cost reduction due to the extended lifespan of the rubber nozzle 2) Unlike other companies' nozzles, we no longer needed to perform hardening before use 3) Reduction in hardening labor hours By discussing the product specifications with our customers and striving for prompt responses, we were able to demonstrate our technical capabilities regarding the surface condition of the rubber nozzle, which was also attractive. Customers appreciated that our products are competitively priced compared to others and have a longer lifespan. *For more details, please download the PDF or feel free to contact us.
- Company:オルテコーポレーション 本社
- Price:Other